By James J. Licari
This e-book is exclusive in its entire assurance of all features of adhesive know-how for microelectronic units and packaging, from idea to bonding to check techniques. as well as basic functions, comparable to dies, substrate, and lid and chip stack attachments, the booklet comprises new advancements in anisotropic, electrically conductive, and underfill adhesives. swift curing tools similar to UV, microwave, and moisture (which conform to present environmental and effort specifications) are lined. Over eighty tables and one hundred twenty figures offer a wealth of knowledge on homes, functionality, and reliability. additionally integrated are examples of commercially on hand adhesives, providers, and gear. every one bankruptcy presents finished references.
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Additional resources for Adhesives Technology for Electronic Applications: Materials, Processing, Reliability
Conductor metallizations are generally gold or aluminum. Conductor line widths and spacings are typically three to five mils. Thin-film resistor patterns may also be integrated with the conductors by depositing and photoetching nichrome or tantalum nitride. A key attribute of thin-film hybrids is the ability to produce precision resistors that, after laser trimming and annealing, have temperature coefficients of resistance (TCRs) as low as 0 ± 3 ppm/°C and resistor drifts of less than 100 ppm after aging 1,000 hours at 150°C.
Schueller, R. , Portable CSP, Advanced Packaging (May 1998) 25. , pp. 91–94 (Feb. 2000) 26. , Advantages of System on a Package and System on a Chip, Electronic Packaging and Production (Jul. 2001) 27. /Aug. 1999) 28. /Jul. 2000) 29. , No Place To Go But Up, Electronic Packaging and Production (Oct. 2001) INTRODUCTION 37 30. Guidelines for Multichip Module Technology Utilization, IPC-MC-790, Institute of Interconnecting and Packaging Electronic Circuits, Lincolnwood, IL (Aug. 1992) 31. Fillion, R.
Researchers were prolific in the 1990s in the development of new approaches to meet the high demand for miniaturized consumer electronics. The requirement for high-throughput automated assembly resulted in the wider use of snap-cure adhesives, UV and microwave rapid-curing adhesives, and silver-glass adhesives. With the greater use of flip-chip and area-array devices and new package designs, faster capillary flow and faster cure underfill adhesives were formulated. At the same time, all these developments had to be moderated by strict government regulations to reduce emissions of volatile organic compounds (VOC).
Adhesives Technology for Electronic Applications: Materials, Processing, Reliability by James J. Licari